Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
1～7 item / All 7 items
Device dimensions: 1200W × 1100D × 2000H (200CBT) / 1500W × 1100D × 2000H (300CBT)
Set the substrate in the chuck manually, then perform paddle development, rinsing, and spin drying.
Automatic processing of each step from paddle development, spray development, rinsing, to spin drying!
We would like to introduce the "Sheet-Type Spin Developer" that we handle. By simply setting the cassette in the loader, the clean robot automatically transports the workpiece and processes each step automatically. For developing large substrates, we recommend the coating method. In the manual type, the workpiece can be manually set in the chuck, and similar developing, rinsing, and spin-drying processes can be performed. 【Specifications (partial)】 ■ Work Material - Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, etc. ■ Developer: TMAH, Na2CO3, cyclopentane (independent chamber) ■ Rinse Liquid: DIW, PGMEA, etc. ■ Back Rinse: PGMEA, etc. ■ Coating Method: Shower or nozzle *For more details, please download the PDF or feel free to contact us.
Pursuing high quality, low price, and space-saving; a developer that supports both swing spray and paddle methods.
The multi-step program can save 99 steps × 50 patterns. Options such as liquid system expansion and liquid temperature control systems are also available. Please consult us for other sizes and custom specifications.
Device dimensions: 1700W × 1300D × 1400H
Set the substrate manually in the chuck, then perform paddle development, rinsing, and spin drying. A canister can be stored on the side of the main unit.
Spin coating device
The process from developing the resist film applied on the glass substrate while rotating it to rinsing with pure water is performed automatically. 【Features】 ● A developing solution purge mechanism is provided, making it easy to change the type of developing solution. ● A robot is used for the left-right movement of the nozzle. The nozzle movement can be set arbitrarily over a wide range of 0 to 400 mm. ● The vertical position of the nozzle can be set arbitrarily over a wide range of 0 to 500 mm. *For details, please request the materials.
For anything related to etching machine production, Kimura Etching.
We design and manufacture various wet processing equipment (etching, developing, stripping, cleaning, etc.) for applications ranging from research and development experimental devices to production equipment. The main material for the equipment body is PVC, but we also manufacture using PP, PVDF, and SUS depending on the chemicals and temperatures used. All of our equipment is custom-made to meet the specific requirements of our customers. We also undertake on-site work such as equipment modifications and relocations.
Device dimensions: 2000W × 1200D × 2000H (200WCBT) / 2000W × 1500D × 2000H (300WCBT)
This is a sheet-type automatic spin developing device that sets the set in the loader, transports the substrate with a clean robot, and performs paddle development, rinsing, and spin drying. It can accommodate two chemical supply tanks or waste liquid tanks (20L) on the side of the main body.
